Destructive Physical Analysis (DPA) in Semiconductors
Destructive Physical Analysis is one of the most powerful tools for understanding and validating semiconductor device construction. Whether ensuring supplier quality, confirming device authenticity, or uncovering failure mechanisms, DPA provides the clarity needed to make confident decisions in a world where reliability is everything.
Why is DPA important in semiconductor reliability?
DPA plays a critical role in ensuring the long-term reliability and integrity of semiconductor components—especially for applications in aerospace, defense, medical, and automotive industries, where failure is not an option. It helps confirm that parts meet stringent quality and performance standards, verifies supplier consistency, and supports counterfeit detection efforts by revealing inconsistencies in die markings, bond structures, or materials.
When is DPA performed?
DPA is typically performed:
- As part of qualification or lot acceptance testing for high-reliability components.
- During failure analysis investigations to determine root cause of a field or test failure.
- For counterfeit or suspect part verification, ensuring authenticity and conformance.
What tests and techniques are part of a typical DPA process?
A complete DPA may include several detailed analyses, such as:
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External Visual Inspection – Examining the package for cracks, corrosion, or marking irregularities.
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X-ray Inspection – Assessing wire bond placement, die attach coverage, and internal alignment before destructive steps.
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Decapsulation – Chemically or mechanically removing the package to expose the die and internal connections.
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Optical and Scanning Electron Microscopy (SEM) – Evaluating die surface, bond quality, and metallization structures.
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Cross-Sectioning – Slicing through the component to view internal layers and interfaces in detail.
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Material Analysis – Using EDX or FTIR to identify materials, contaminants, or process residues.
How does DPA support root cause and reliability analysis?
By providing a direct view of internal component structures, DPA enables engineers to pinpoint the exact cause of a potential defect—whether it’s design-related, process-induced, or due to environmental stress. This data is vital for improving manufacturing processes, verifying corrective actions, and preventing future failures.
What standards govern DPA testing?
DPA is commonly performed in accordance with industry standards such as:
- MIL-STD-1580 – Destructive Physical Analysis for Electronic Parts
- PEM-INST-001 (most requirements refer to Mil-Std-1580)
- MSFC-STD-3012 (most requirements refer to Mil-Std-1580)
- SSQ 25000 Rev B (Space Station) (most requirements refer to Mil-Std-1580)
- ESCC Basic Specification No. 21001 (European standard)
Compliance with these standards ensures uniform procedures, traceability, and dependable results.
What is the benefit of using an accredited lab for DPA?
Working with a qualified, ISO 9001 / AS9100-certified laboratory ensures testing accuracy, compliance with military standards, and complete traceability. Accredited labs provide the confidence that data meet customer, OEM, and government agency requirements.
How does DPA support counterfeit mitigation in defense applications?
Counterfeit components pose a serious threat to defense reliability and national security. DPA exposes potential inconsistencies in construction or materials that indicate non-authentic parts, ensuring that only genuine, conforming components are deployed in critical systems.
How does Integra Technologies approach DPA?
At Integra, we combine precision techniques, advanced analytic tools, and experienced analysts to deliver accurate, actionable insights from every DPA. Our team ensures that each step—from sample preparation to final documentation—is performed with the highest attention to detail, supporting your qualification, failure analysis, and counterfeit detection needs.